GNY51-1-05

Idiwọn Yipada Stroke PUSH Slug Column Micro yipada Blue 1NO 1NC dara julọ ju LXW20-11


GNY51-1-05

ọja Tags

GNY51-1-05

GNY51-1-05-

(Yipada timọ-ẹrọAwọn abuda):

(Nkan)

(paramita imọ-ẹrọ)

(Iye)

1

(Iwọn Itanna) 10A 250VAC

2

(Atako Olubasọrọ) ≤50mΩ(Iye akọkọ)

3

(Atako idabobo) ≥100MΩ(500VDC)

4

(Dielectric Foliteji) (laarin awọn ebute ti ko ni asopọ) 500V/0.5mA/60S
(laarin awọn ebute ati fireemu irin) 1500V/0.5mA/60S

5

(Igbesi aye Itanna) ≥50000 iyipo

6

(Igbesi aye ẹrọ) ≥100000 iyipo

7

(Iwọn otutu ti nṣiṣẹ) 0~125℃

8

(Igbohunsafẹfẹ Ṣiṣẹ) (itanna): 15awọn iyipo(Mekaniki):60awọn iyipo

9

(Imudaniloju gbigbọn)

(Igbohunsafẹfẹ Gbigbọn) : 10~55HZ::::1.5mm;

10

(Agbara Solder): (Die sii ju 80% ti apakan immersed yoo wa ni bo pelu solder) (Iwọn otutu tita): 235 ± 5 ℃ (Aago Immersing) :2~3S

11

(Solder Heat Resistance) (Dip Soldering): 260 ± 5 ℃ 5 ± 1S (Afọwọṣe Soldering)

12

(Awọn ifọwọsi Aabo)

UL, CSA, TUV, CQC, CE

13

(Awọn ipo idanwo) (Iwọn otutu ibaramu): 20 ± 5 ℃ (Ọriniinitutu ibatan): 65 ± 5% RH (Iwọn afẹfẹ) :86 ~ 106KPa

Lilo ati itọju
(1) Ṣayẹwo bọtini naa nigbagbogbo lati yọ idoti lori rẹ. Nitori aaye kekere laarin awọn olubasọrọ ti bọtini naa, lẹhin ọpọlọpọ ọdun ti lilo tabi asiwaju ko dara, sisan ti eruku tabi awọn ipele oriṣiriṣi ti emulsion epo epo yoo jẹ ki idabobo naa dinku tabi paapaa ijamba Circuit kukuru. Ni ọran yii, idabobo ati mimọ gbọdọ wa ni ṣe, ati pe awọn igbese edidi ti o baamu gbọdọ jẹ.
(2) Nigbati a ba lo bọtini naa ni agbegbe otutu ti o ga, o rọrun lati ṣe atunṣe ati ọjọ-ori ṣiṣu, nfa ki bọtini naa ṣii, nfa kukuru kukuru laarin awọn skru ebute. Ni ibamu si ipo naa, a le ṣafikun oruka mimu lati mu u fun lilo lakoko fifi sori ẹrọ, tabi tube ṣiṣu idabobo le ṣe afikun si skru onirin lati yago fun sisọ.
(3) Fun bọtini pẹlu ina atọka, boolubu naa yoo gbona, ati pe atupa ṣiṣu ṣiṣu yoo jẹ ibajẹ fun igba pipẹ, eyiti yoo jẹ ki o ṣoro lati rọpo boolubu naa. Nitorinaa, ko dara lati lo ni awọn aaye nibiti agbara wa fun igba pipẹ; ti o ba fẹ lo, o le dinku foliteji boolubu ni deede lati fa igbesi aye rẹ pọ si.
(4) Ti o ba ti ri olubasọrọ ti ko dara, idi naa yẹ ki o ṣe iwadi: ti aaye olubasọrọ ba bajẹ, o le ṣe atunṣe pẹlu faili itanran; ti o ba jẹ dọti tabi soot lori aaye olubasọrọ, o yẹ ki o parun mọ pẹlu asọ owu ti o mọ ti a fibọ sinu epo; ti o ba jẹ orisun omi olubasọrọ Ti o ba kuna, o yẹ ki o rọpo; ti olubasọrọ ba ti jona pupọ, o yẹ ki o rọpo ọja naa.

GNY51-1-01

GNY51-1-01-

(Yipada timọ-ẹrọAwọn abuda):

(Nkan)

(paramita imọ-ẹrọ)

(Iye)

1

(Iwọn Itanna) 10A 250VAC

2

(Atako Olubasọrọ) ≤50mΩ(Iye akọkọ)

3

(Atako idabobo) ≥100MΩ(500VDC)

4

(Dielectric Foliteji) (laarin awọn ebute ti ko ni asopọ) 500V/0.5mA/60S
(laarin awọn ebute ati fireemu irin) 1500V/0.5mA/60S

5

(Igbesi aye Itanna) ≥50000 iyipo

6

(Igbesi aye ẹrọ) ≥100000 iyipo

7

(Iwọn otutu ti nṣiṣẹ) 0~125℃

8

(Igbohunsafẹfẹ Ṣiṣẹ) (itanna): 15awọn iyipo(Mekaniki):60awọn iyipo

9

(Imudaniloju gbigbọn)

(Igbohunsafẹfẹ Gbigbọn) : 10~55HZ::::1.5mm;

10

(Agbara Solder): (Die sii ju 80% ti apakan immersed yoo wa ni bo pelu solder) (Iwọn otutu tita): 235 ± 5 ℃ (Aago Immersing) :2~3S

11

(Solder Heat Resistance) (Dip Soldering): 260 ± 5 ℃ 5 ± 1S (Afọwọṣe Soldering)

12

(Awọn ifọwọsi Aabo)

UL, CSA, TUV, CQC, CE

13

(Awọn ipo idanwo) (Iwọn otutu ibaramu): 20 ± 5 ℃ (Ọriniinitutu ibatan): 65 ± 5% RH (Iwọn afẹfẹ) :86 ~ 106KPa

GNY51-1-02

GNY51-1-02-

(Yipada timọ-ẹrọAwọn abuda):

(Nkan)

(paramita imọ-ẹrọ)

(Iye)

1

(Iwọn Itanna) 10A 250VAC

2

(Atako Olubasọrọ) ≤50mΩ(Iye akọkọ)

3

(Atako idabobo) ≥100MΩ(500VDC)

4

(Dielectric Foliteji) (laarin awọn ebute ti ko ni asopọ) 500V/0.5mA/60S
(laarin awọn ebute ati fireemu irin) 1500V/0.5mA/60S

5

(Igbesi aye Itanna) ≥50000 iyipo

6

(Igbesi aye ẹrọ) ≥100000 iyipo

7

(Iwọn otutu ti nṣiṣẹ) 0~125℃

8

(Igbohunsafẹfẹ Ṣiṣẹ) (itanna): 15awọn iyipo(Mekaniki):60awọn iyipo

9

(Imudaniloju gbigbọn)

(Igbohunsafẹfẹ Gbigbọn) : 10~55HZ::::1.5mm;

10

(Agbara Solder): (Die sii ju 80% ti apakan immersed yoo wa ni bo pelu solder) (Iwọn otutu tita): 235 ± 5 ℃ (Aago Immersing) :2~3S

11

(Solder Heat Resistance) (Dip Soldering): 260 ± 5 ℃ 5 ± 1S (Afọwọṣe Soldering)

12

(Awọn ifọwọsi Aabo)

UL, CSA, TUV, CQC, CE

13

(Awọn ipo idanwo) (Iwọn otutu ibaramu): 20 ± 5 ℃ (Ọriniinitutu ibatan): 65 ± 5% RH (Iwọn afẹfẹ) :86 ~ 106KPa

GNY51-2-200

GNY51-2-200-

Yipada imọ Abuda

GNY51

(Yipada timọ-ẹrọAwọn abuda):

(Nkan)

(paramita imọ-ẹrọ)

(Iye)

1

(Iwọn Itanna) 10A 250VAC

2

(Atako Olubasọrọ) ≤50mΩ(Iye akọkọ)

3

(Atako idabobo) ≥100MΩ(500VDC)

4

(Dielectric Foliteji) (laarin awọn ebute ti ko ni asopọ) 500V/0.5mA/60S
(laarin awọn ebute ati fireemu irin) 1500V/0.5mA/60S

5

(Igbesi aye Itanna) ≥50000 iyipo

6

(Igbesi aye ẹrọ) ≥100000 iyipo

7

(Iwọn otutu ti nṣiṣẹ) 0~125℃

8

(Igbohunsafẹfẹ Ṣiṣẹ) (itanna): 15awọn iyipo(Mekaniki):60awọn iyipo

9

(Imudaniloju gbigbọn)

(Igbohunsafẹfẹ Gbigbọn): 10 ~ 55HZ;

(Titobi): 1.5mm;

(Awọn itọnisọna mẹta): 1H

10

(Agbara Solder): (Die sii ju 80% ti apakan immersed yoo wa ni bo pelu solder) (Iwọn otutu tita): 235 ± 5 ℃ (Aago Immersing) :2~3S

11

(Solder Heat Resistance) (Dip Soldering): 260 ± 5 ℃ 5 ± 1S (Afọwọṣe Soldering)

12

(Awọn ifọwọsi Aabo)

UL, CSA, TUV, CQC, CE

13

(Awọn ipo idanwo) (Iwọn otutu ibaramu): 20 ± 5 ℃ (Ọriniinitutu ibatan) : 65 ± 5% RH

(Atẹgun afẹfẹ): 86 ~ 106KPa


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