Subminiature Ipilẹ Yipada
HK-14-16AP-605
| Awọn ẹya ara ẹrọ asọye ti isẹ | Parameter iṣẹ | Iye | Awọn ẹya |
 | Free Ipo FP | 15.9 ± 0.2 | mm |
| Ipo Iṣiṣẹ OP | 14.9 ± 0.5 | mm | |
| Idasile Ipo RP | 15.2 ± 0.5 | mm | |
| Lapapọ ipo irin ajo | 13.1 | mm | |
| Awọn ọna Force OF | 0.25-4 | N | |
| Tu silẹ Force RF | - | N | |
| Total ajo Force TTF | - | N | |
| Ṣaaju Irin-ajo PT | 0.5 ~ 1.6 | mm | |
| Lori Irin-ajo OT | 1.0 min | mm | |
| Iyatọ gbigbe MD | 0.4 ti o pọju | mm |
| Nkan | imọ paramita | Iye | |
| 1 | Olubasọrọ Resistance | ≤30mΩ Iye ibẹrẹ | |
| 2 | Idabobo Resistance | ≥100MΩ500VDC | |
| 3 | Dielectric Foliteji | laarin ti kii-ti sopọ ebute | 1000V/0.5mA/60S |
| laarin awọn ebute oko ati irin fireemu | 3000V / 0.5mA / 60S | ||
| 4 | Itanna Life | ≥50000 iyipo | |
| 5 | Igbesi aye ẹrọ | ≥1000000 awọn iyipo | |
| 6 | Awọn iwọn otutu ti nṣiṣẹ | -25 ~ 125 ℃ | |
| 7 | Igbohunsafẹfẹ Ṣiṣẹ | itanna: 15 waye Mechanical: 60 iyipo | |
| 8 | Ẹri gbigbọn | Igbohunsafẹfẹ Igbohunsafẹfẹ: 10 ~ 55HZ; Iwọn titobi: 1.5mm; Awọn itọnisọna mẹta: 1H | |
| 9 | Agbara Solder: Diẹ sii ju 80% ti apakan immersed yoo wa ni bo pelu solder | Awọn iwọn otutu tita: 235 ± 5 ℃ Akoko Ibọsi: 2 ~ 3S | |
| 10 | Solder Heat Resistance | Dip Soldering:260±5℃ 5±1S Soldering Afowoyi: 300± 5℃ 2 ~ 3S | |
| 11 | Awọn Ifọwọsi Aabo | UL, CSA, VDE, ENEC, TUV, CE, KC, CQC | |
| 12 | Awọn ipo Idanwo | Iwọn otutu ibaramu: 20± 5℃ Ọriniinitutu ibatan: 65± 5% RH Agbara afẹfẹ: 86 ~ 106KPa | |
Ohun elo Yipada: lilo pupọ ni ọpọlọpọ awọn ohun elo ile, ohun elo itanna, ohun elo adaṣe, ohun elo ibaraẹnisọrọ, ẹrọ itanna, awọn irinṣẹ agbara ati awọn aaye miiran.